NTE424 compound equivalent, non-silicone heat sink compound.
D Non−Silicone Avantages/No Creep or Migration over Wide Temperature Range D Low Interface Thermal Resistance (0.03°C−In2/W) D High Thermal Conductivity, High Dielectric.
The NTE424 heat sink compound is applied to the base and mounting studs of transistors, diodes and silicon controlled r.
Image gallery
Download